AMD “Strix Halo” Zen5 & RDNA3.5 premium APU rumors take shape

AMD first ultra-high-end APU with 16 Zen5 cores and 40 RDNA3.5 CUs is said to feature LPDDR5X memory

Recent leaks and speculation were put together by Chiphell forum member. 

AMD is said to be launching its Strix Halo APUs next year. It’s one of the most interesting hardware releases from AMD in many years, given that it incorporates high CPU core count as well as very powerful graphics. It’s an “Ultimate APU” segment that will likely tackle the Apple M-Series chips that feature similar configurations; however, in this case, it’s an x86 architecture powered by AMD’s latest architectures.

According to the slides presented on Chiphell forums, the Strix Halo is using 16 Zen5 cores on two CCDs. The rumor alleges that these are the same chiplets that will be used on the desktop (Granite Ridge) series. Those CCDs are supposedly made using TSMC N4X process node. AMD is supposedly planning 16-core and 12-core versions featuring 40CU and 32CU GPU configurations, respectively.

A breakdown of the recent rumors has been put into the following slide, which, as one might tell, it’s not a leak but a speculation. Other people familiar with the AMD roadmaps, such as Olrak, claim that some information is correct, while other details are not.

AMD Strix Halo rumors, Source: Chiphell

In terms of the GPU, there is an RDNA3.5 chiplet with up to 40 Compute Units. This chiplet is supposedly made with TSMC N4P node and will measure around 200 mm² in size. It would also boost up to 3.0 GHz. In 3DMark tests that were shared alongside the slides, it is said that the 32CU version would compete with the GeForce RTX 4060M at 110W TDP, while the 40CU version could get close to the RTX 4070M. These claims are in regard to the 3DMark TimeSpy score, while Speedway and Port Royal tests, which involve ray tracing, would still show NVIDIA GPUs’ advantage by around 20%.

AMD F11 package/chipset details, Source: Chiphell

AMD Strix Halo Rumors

• Socket: FP11
• CPU: 16x Zen5 (2x CCD)
  • Node: TSMC N4X
  • Turbo Clock up to: 5.8 GHz
  • Die Size: 80-85 mm2
• GPU: 40CU RDNA 3.5
  • Node: TSMC N4P
  • Boost Clock up to: 3.0 GHz
  • Die Size: 200 mm2
• NPU: 45-50 TOPS
• Memory: 256-bit LPDDR5X-8533 (~500 GB/s)
• TDP: 45-150/175W

The Strix Halo is expected to make a debut in high-end gaming systems, premium laptops and Mini-PCs. Unlike traditional gaming laptops, they will require less sophisticated cooling because the GPU and CPU will be placed in a single package. Where Strix Halo is unlikely to appear are handheld gaming devices, which require more power-efficient configurations (15-30W). The TDP for Halo is now expected to be in between 45W and 175W.

Source: Chiphell